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The physical properties of the deposit, specifically tensile strength and elongation, have to be controlled so the product can withstand, without cracking, the temperature excursions of assembly and of useA successful copper-plating system must be able to provide a copper deposit with tensile strength between 40 and 50 kpsi and percent elongation between 10 and 25 percent As demands for speed and impedance control continue to increase, the thickness uniformity of the plated copper becomes extremely critical In the late 1990s, significant developments occurred in HDI boards, usually for portable products HDI has traditionally focused on the high-end telecommunications, imaging, and computing markets Handheld electronics products present unique challenges in terms of size, weight, functionality, and cost This poses a series of challenges to the board manufacturer in every processing area Acid copper electroplating is quickly becoming the limiting factor in most board shops today.

High-aspect ratio plating, 3 mil lines and spaces, laser-drilled microvias, as well as buried vias, are forcing the industry to look for innovative approaches to the traditional methods of plating 2951 Pattern Plating versus Panel Plating Panel plating does not involve any patterning or imaging before plating and hence has a uniform surface geometry; with good plating practice, less than 10 percent thickness variation across the panel and from panel to panel is achievable The challenge here is to get good throwing power so as not to overplate the surface to achieve 10 mil in the holeAn overplated surface limits the line width and spaces that can be circuitized by subsequent etching Pattern plating, as the name implies, occurs after pattern or image transfer and, accordingly, is the real challenge for the plating process.

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Here, the surface geometry is not uniform and may have extremes of isolated traces and pads, as well as ground plane areas This gives rise to great disparity in primary current distribution, which can result in two to four times thicker copper in the isolated areas, compared with the ground plane areas..

29.5.2 Thickness Distribution A formidable challenge facing acid copper plating of printed circuit boards is thickness distribution on the surface of the panel (whether pattern or panel plated) and thickness distribution in the barrel of the hole or the via, namely throwing power. If the throwing power is 100 percent, then plating 1 mil of copper in the hole would result in plating 1 mil on the surface. At 50 percent throwing power, to achieve 1.0 mil in the hole would result in 2.0 mils on the surface, which would limit the etching capabilities in the panel plate and increase the thickness variation in pattern plate. HDI compounds the plating challenges with microvias, small holes, and fine lines. Different approaches are being practiced to resolve the following four plating issues:

( ) ( ) ( )

Low-current-density plating Chemically mediated process Electrically mediated process Horizontal conveyorized systems

Additives in Acid Copper Plating Additives used for bright acid copper plating are divided into three categories: (1) the carrier or suppressor, (2) the additive or brightener, and (3) a leveling component. Each component has a specific role in controlling the quality of the deposit. Polarization curves that show the ensuing current as the voltage is increased are used to study the effects of the various components on the plating system and how they affect the deposit. Figure 29.6 shows a polarization curve where the current is plotted against the voltage. The data can be obtained from a potentiostat setup, shown in Fig. 29.7. Here, we have three electrodes in the plating solution. The first is a counter electrode and is usually made of copper or platinum; the second is the working electrode and is a rotating platinum disk; and the third is the reference electrode, like a double-junction calomel. Voltage is applied between the working and the reference electrodes, and the ensuing current is measured between the working and the counter electrodes.This is the principle upon which cyclic voltametric stripping (CVS)

0 1 0 1

1. Counter Electrode (Cu or Pt) 2. Working Electrode (Rotating Pt Disk) 3. Reference Electrode (Double-Junction Calomel or AgCl)

is based. CVS equipment is commonly used to assay the additives in the plating solution. A closer look at the polarization curve shows four distinct areas:

Low-current area Here, there is a minimum increase in current as the voltage is increased. Metal deposition area This is an area where there is a significant increase of current with applied voltage. Limiting-current-density area This area is marked by a plateau, where there is no increase of current as the applied voltage continues to rise. Hydrogen evolution part of the curve This is the last area.

3 2 = 126 10, 10(126), 10(126)2, 10(126)3, 10(126)4, 10(126)5, 10(126)6, 10(126)7, 10(126)8, 10(126)9, 10(126)10,

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